Taiwan Semiconductor Plans Major Global Expansion, Sets Record $38 Billion Investment Target

Taiwan Semiconductor Manufacturing Co (NYSE:TSM) is gearing up for an ambitious global expansion, setting its sights on significantly increasing its production capacity.

The company plans to initiate construction on several new semiconductor fabrication plants worldwide by 2025, with more than ten facilities either newly built or under construction, Economic Daily News reports.

The contract chipmaker’s substantial capital investment will likely climb to unparalleled levels in 2025, with legal forecasts suggesting expenditures could range from $34 billion to $38 billion, pushing the company’s capital outlay to record highs.

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Industry insiders told Economic Daily News this surge in capital spending is a direct response to the growing demand for advanced semiconductor manufacturing processes, including the ramp-up of 2-nanometer technology.

Taiwan Semiconductor’s ongoing expansion involves multiple projects within Taiwan, including significant developments in Hsinchu and Kaohsiung.

According to the report, these ...

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